Direct-to-chip Liquid Cooling


Tomorrow’s data centers demand more than traditional cooling. As AI, cloud, and high-performance computing push boundaries, advanced cooling is a necessity.
Delivering maximum efficiency reliability, next-generation solutions keep your infrastructure ahead of the curve.
 
Direct-to-chip liquid cooling circulates coolant through cold plates attached directly to heat-generating components, delivering superior thermal performance while significantly reducing energy consumption. 
 
By minimizing reliance on air cooling, this solution supports high-density workloads and lowers overall carbon footprint—helping data centers meet both performance and environmental goals.

Tomorrow’s data centers demand more than traditional cooling. As AI, cloud, and high-performance computing push boundaries, advanced cooling is a necessity.
Delivering maximum efficiency reliability, next-generation solutions keep your infrastructure ahead of the curve.
 
Direct-to-chip liquid cooling circulates coolant through cold plates attached directly to heat-generating components, delivering superior thermal performance while significantly reducing energy consumption. 
 
By minimizing reliance on air cooling, this solution supports high-density workloads and lowers overall carbon footprint—helping data centers meet both performance and environmental goals.
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Direct-to-chip Liquid Cooling

DOWFROST™ LC 25 - The Solution for Liquid Cooling

With superior thermal performance that significantly reduces energy consumption DOWFROST™ LC 25 is designed for efficient heat removal in Direct-to-Chip (D2C) cooling applications. 

DOWFROST™ LC 25 is made with Dow PuraGuard™ Propylene Glycol USP/EP, a pharmaceutical grade of Monopropylene glycol with one of the highest purities in the market, specified at 99.8% or greater. 

Most notably, DOWFROST™ LC 25 offers exceptional corrosion protection compared to water and uninhibited propylene glycol. It is a glycol-based fluid that is fully inhibited and naturally biostatic, removing the need for harmful biocides and reducing both health and environmental concerns. It also requires significantly less maintenance than treated water helping to reduce downtime, operational difficulties, and the risk of system blockages.  

DOWFROST™ LC 25 is compatible with common metals (including carbon steel, stainless steels, cast iron, copper, brass, bronze, and solder) and most plastic pipe (HDPE, PEX, PP). 

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Why Choose DOWFROST™ LC 25?

Superior Corrosion Protection

Specially formulated to protect high-surface-area copper and other common metals in liquid-cooled systems.

Protection from -10°C (14°F) to 90°C (194°F)

With a temperature range of 100°C DOWFROST™ LC 25 will meet your specific temperature and performance needs.

Fluorescent Leak Detection

Dyed bright yellow for easy visual identification of leaks during maintenance.

Optimized for Direct-to-Chip Cooling

Designed for use in in-rack or external Cooling Distribution Units (CDUs) across multiple server racks.

Dow Global Scale Supply

Local Reliability & Decades of Technical Excellence

Approved by Industry Leaders

Trusted by hyperscalers for D2C cooling. Dow has a 90-year history in high quality heat transfer fluids and is an OCP solution provider.

Running successfully in over 7 GW of global D2C data centers.

Dependable Supply

As the largest PG producer in the world, Dow is back integrated to raw material with blending sites in all 4 global regions and excellent technical and analytical support.

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Product Direct-to-chip Liquid Cooling

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