Data Center Coolants

As data centers evolve to support AI, cloud, and high-performance computing (HPC) the need for advanced cooling has never been greater. Modern data center environments demand highly efficient, sustainable, and scalable cooling solutions to manage increasing thermal loads and ensure optimal performance.
 
Whether you're designing hyperscale facilities or edge computing sites, choosing the right coolant is essential for thermal management, environmental compliance, and operational efficiency. Our selection of data center coolants is engineered to meet the demands of next-generation infrastructure, offering superior heat transfer, low conductivity, and compatibility with a wide range of hardware.
As data centers evolve to support AI, cloud, and high-performance computing (HPC) the need for advanced cooling has never been greater. Modern data center environments demand highly efficient, sustainable, and scalable cooling solutions to manage increasing thermal loads and ensure optimal performance.
 
Whether you're designing hyperscale facilities or edge computing sites, choosing the right coolant is essential for thermal management, environmental compliance, and operational efficiency. Our selection of data center coolants is engineered to meet the demands of next-generation infrastructure, offering superior heat transfer, low conductivity, and compatibility with a wide range of hardware.
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Data Center Coolants

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    Our local presence and strong infrastructure in the Nordic regions allow us to secure reliability in the supply chain, whether it be availability, packaging or volume, we will ensure we provide tailor made solutions that meet your specific needs.

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    Cooling Technologies


    Air Cooling

    Air cooling typically involves Computer Room Air Conditioning (CRAC) or Computer Room Air Handler (CRAH) units to deliver chilled air through data center aisles, effectively removing heat from servers.

    As the most widely adopted cooling method, it offers a proven, dependable solution for traditional data centers operating at moderate power densities. 

    Direct-To-Chip Liquid Cooling

    Next-generation liquid cooling technologies are redefining efficiency and sustainability in data centers.

    Direct-to-chip liquid cooling circulates coolant through cold plates attached directly to heat-generating components, delivering superior thermal performance while significantly reducing energy consumption. 

    By minimizing reliance on air cooling, this solution supports high-density workloads and lowers overall carbon footprint—helping data centers meet both performance and environmental goals. 

    Immersion Liquid Cooling

    Immersion cooling takes efficiency and sustainability to the next level. 

    By submerging entire servers in a dielectric liquid, this technology absorbs heat directly at the source, eliminating the need for air cooling and server fans.

    This results in dramatically lower energy consumption, near-zero water usage, and reduced noise making it ideal for ultra-high-density environments, edge computing, and organizations committed to sustainable operations.

    Key Products for air cooling: 

    DOWCAL™ 100E - Superior heat transfer capabilities and excellent corrosion protection. Available in various dilutions.

    DOWCAL™ 200E - Non-Toxic and excellent corrosion protection. Available in various dilutions.

    Key Products for liquid cooling: 

    DOWFROST™ LC25 - PG25, ready to use, from Dow is designed to meet technical properties to operate in liquid cooling technology through cold plates attached directly to heat-generating components. DOWFROST™ LC 25 delivers superior thermal performance while significantly reducing energy consumption.

    Comparing Technologies


    Cooling Method

    Efficiency (PUE)

    Power Density

    Complexity

    Maintenance

    Carbon Footprint Impact

    Water Usage

    Air CoolingLow (1.5–1.8)Up to ~15 kW/rackSimpleEasy

    High – baseline; highest operational emissions

    High (evaporative cooling often used)

    Direct-to-Chip Liquid CoolingHigh (1.1–1.3)30–80 kW/rackModerateModerate

    ~40–50% lower than air cooling over life cycle

    Low (closed-loop systems)

    Immersion Cooling

    Very High (1.05)80–100+ kW/rackHighSpecialized

    Up to 50% lower than air cooling; best sustainability performance

    Near Zero (dielectric fluids, no evaporation)

    Cooling Method Efficiency (PUE) Power Density Complexity Maintenance Carbon Footprint Impact Water Usage
    Air Cooling Low (1.5–1.8) Up to ~15 kW/rack Simple Easy High – baseline; highest operational emissions High (evaporative cooling often used)
    Direct-to-Chip Liquid Cooling High (1.1–1.3) 30–80 kW/rack Moderate Moderate ~40–50% lower than air cooling over life cycle Low (closed-loop systems)
    Immersion Cooling Very High (1.05) 80–100+ kW/rack High Specialized Up to 50% lower than air cooling; best sustainability performance Near Zero (dielectric fluids, no evaporation)

    Contact Our Technical Experts


    Wether it is support choosing the right product, or the best cooling system and chemicals for your business. We have local technical support ready to assist. 

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